The Hyundai Motor Chung Mong-Koo Foundation (hereinafter referred to as the “Foundation”) complies with the Personal Information Protection Act and, in relation to the scholarship programs of the Hyundai Motor Chung Mong-Koo Foundation, hereby seeks your consent for the collection and use (provision) of personal information as provided below. Take time to read the details carefully and decide whether to provide your consent.
[Relevant Provisions: Articles 15, 17, 22, 23, and 24 of the Personal Information Protection Act]
The Hyundai Motor Chung Mong-Koo Foundation (hereinafter referred to as the “Foundation”) highly values the personal information of its users and makes every effort to comply with the “Act on Promotion of Information and Communications Network Utilization and Information Protection” and the “Personal Information Protection Act.”
The Foundation’s Privacy Policy hereby informs users how and in what manner the Foundation uses the personal information they provided, as well as the measures taken to protect such personal information.
Collected with the consent of the data subject during the membership registration and service use process.
Membership management, sending of advertising information, and marketing use (for those who have consented)
(1) Required: Name, gender, nationality, email (ID), date of birth, mobile phone number or other contact information, and duplication information (DI)
※ The mobile phone number used is the one authenticated by the NICE Information Service.
※ The following personal information items may be automatically generated and collected during the use
of Internet services. (IP address, cookies, mac address, service usage records, visit records, history of
misuse, etc.)
You have the right to refuse consent to the collection and use of personal information. However, refusal to consent will result in restrictions on membership registration.
The Foundation outsources the processing of personal information as outlined below to facilitate the efficient handling of data.
In outsourcing agreements, the Foundation stipulates—according to Article 25 of the Act on Promotion of Information and Communications Network Utilization and Information Protection and Article 26 of the Personal Information Protection Act—that personal data must not be processed for purposes other than the outsourced task, prescribes technical and administrative protective measures, limits re-outsourcing, manages and supervises the trustee, and outlines the responsibilities for damages, thereby ensuring secure handling of personal data.
Should there be any changes in the outsourced work or outsourcer, the Foundation will promptly disclose such information through this Privacy Policy.
If you want to receive emails about upcoming scholarship recruitments, event details, and service announcements, please consent to marketing use.
Collected with the consent of the data subject during the membership registration and service use process.
Transmission of promotional information and marketing use
(1) Name, email (ID), mobile phone number, and email address
※ The following personal information items may be automatically generated and collected during the use of Internet services. (IP address, cookies, mac address, service usage records, visit records, history of misuse, etc.)
In general, the Foundation processes and retains personal information until the withdrawal of membership or loss of member status by the data subject.
You may register as a member regardless of whether or not you choose to receive such information. If you do not agree, however, you will not be able to receive information and updates from the Hyundai Chung Mong-Koo Foundation’s scholarship website.
(Information related to application and activities, such as acceptance announcements, notices related to selection, and continuous support review information, will be sent regardless of consent/non-consent to marketing and advertising.)
Please use the 1:1 Question form for any questions about the CMK Scholarship programs.
We will get back to you as soon as possible.
